Paras Defence arm to set up ₹6,200 crore semiconductor packaging facility in Madhya Pradesh
- Posted on July 22, 2026
- By Business News Today
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Paras Defence arm to set up ₹6,200 crore semiconductor packaging facility in Madhya Pradesh
Paras Semiconductors is set to invest ₹6,200 crore in the construction of a cutting-edge semiconductor packaging facility in Madhya Pradesh. This initiative follows the signing of a significant memorandum of understanding and aims to elevate India's semiconductor industry through advanced outsourced assembly and testing operations, catering to evolving technological demands.
