Press Center - HBM5 20hi Stack to Adopt Hybrid Bonding Technology, Potentially Transforming Business Models, Says TrendForce | TrendForce - Market research, price trend of DRAM, NAND Flash, LEDs, TFT-LCD and green energy, PV
- Posted on October 30, 2024
- By Google News
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Press Center - HBM5 20hi Stack to Adopt Hybrid Bonding Technology, Potentially Transforming Business Models, Says TrendForce | TrendForce - Market research, price trend of DRAM, NAND Flash, LEDs, TFT-LCD and green energy, PV
TrendForce reports that the focus on HBM products in the DRAM industry is increasingly turning attention toward advanced packaging technologies like hybrid bonding. Major HBM manufacturers are considering whether to adopt hybrid bonding for HBM4 16hi stack products but have confirmed plans to implement this technology in the HBM5 20hi stack generation.
