Nvidia CEO says its advanced packaging technology needs are changing

Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on Thursday, after he was asked whether the company was cutting orders. Nvidia's most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip on wafer on substrate (CoWoS) advanced packaging technology offered by Taiwan Semiconductor Manufacturing Co (TSMC), Nvidia's main contract chipmaker.