Latest News In AI Chips - NVIDIA's Groundbreaking AI Platform with TSMC's Innovative Technology

TechInsights has released preliminary findings from their teardown analysis of NVIDIA's Blackwell HGX B200 platform, highlighting significant advancements in AI and high-performance computing within data centers. Among the noteworthy innovations, SK hynix provides high-bandwidth memory (HBM3E) for NVIDIA's GB100 graphics processing unit (GPU), which integrates TSMC's cutting-edge packaging architecture. This GPU marks the first commercial implementation of TSMC's CoWoS-L packaging technology,...