Beijing plans 12-inch wafer fab, pouring US$4.6 billion into new chip project
- Posted on November 16, 2024
- By South China Morning Post
- 2 Views
Beijing plans 12-inch wafer fab, pouring US$4.6 billion into new chip project
Beijing Yandong Microelectronics will take a controlling position with a 25 per cent stake, while other investors include display maker BOE Technology.
