AI's next bottleneck: Why even the best chips made in the U.S. take a round trip to Taiwan
- Postato il 8 aprile 2026
- Di CNBC
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AI's next bottleneck: Why even the best chips made in the U.S. take a round trip to Taiwan
Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.
