Inside AT&S and the race to make the critical layer beneath AI chips
- Posted on September 26, 2026
- By CNBC
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- 1 min read
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Inside AT&S and the race to make the critical layer beneath AI chips
Managing Asia’s Christine Tan goes inside AT&S’s Malaysia plant, where CEO Michael Mertin explains why IC substrates — the high-tech base layers beneath AI chips — are becoming more important as AI demand grows and manufacturers race to add capacity.
