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Huawei touts chip breakthrough to shorten gap with TSMC

  • Posted on May 25, 2026
  • By Fortune
  • 0 Views
  • 1 min read
Huawei touts chip breakthrough to shorten gap with TSMC
Huawei touts chip breakthrough to shorten gap with TSMC

Huawei will start making 1.4-nanometer chips by 2031 with its own “LogicFolding” technology, Huawei’s semiconductor chief He Tingbo said Monday.
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Author
Fortune

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